Destructive Physical Analysis (DPA) is required to verify the internal construction, materials, and workmanship of electronic components that cannot be fully assessed through non-destructive methods. By physically opening and examining a device, DPA confirms compliance with specifications, detects hidden defects, identifies counterfeit or substandard parts, and ensures long-term reliability for high-risk or mission-critical applications. This analysis provides objective evidence of component integrity, reducing the risk of failure in the field and supporting quality, safety, and regulatory requirements.
DPA reports are produced in compliance with DLA MIL-STD-1580 and contain detailed technical information on component construction, wire pull-strength, die shear strength, chip topography, and cross-sectional analysis to ensure manufacturing processes provided sufficient metallization and passivation for device operation in harsh environments.